¿¤¿¡ÀÌƼ

¿­Ã³¸®ÀåÄ¡

¿­Ã³¸®ÀåÄ¡ Images
RAPID THERMAL PROCESS SYSTEM
LAY-OUT ITEM DESCRIPTION
System Composition Process Module
Substrate Size ~8inch
Heating Source Halogen Lamp
Max. Heating Temperature ~1000¡É
RAPID THERMAL ANNEALING SYSTEM
LAY-OUT ITEM DESCRIPTION
System Composition Process Module
Substrate Size ~8inch Wafer 1 Set
Heating Source Halogen Lamp
Max. Heating Temperature ~Max. 1100¡É
A