융복합장치(In-Line / Cluster / Merge)
융복합 장치 Images
IN-LINE SPUTTERING SYSTEM
| LAY-OUT | ITEM | DESCRIPTION |
|---|---|---|
 |
System Composition | Process Module |
| Substrate Size | ~8inch | |
| Heating Source | Halogen Lamp | |
| Max. Heating Temperature | ~1000℃ |
CLUSTER SYSTEM
| LAY-OUT | ITEM | DESCRIPTION |
|---|---|---|
 |
System Composition | Process Module |
| Substrate Size | ~8inch Wafer 1 Set | |
| Heating Source | Halogen Lamp | |
| Max. Heating Temperature | ~Max. 1100℃ |
DUAL LOAD-LOCK SYSTEM
| LAY-OUT | ITEM | DESCRIPTION |
|---|---|---|
 |
System Composition | Process Module(SPT) + L/L Module + Process Module(RIE) |
| Substrate Size | ~6inch Wafer | |
| Gun Size | 2~4inch | |
| Power Generator | RF Power ~1KW @ Auto Matching DC Power ~1KW @ Noise Filter |
PHSICAL VAPOR DEPOSITION SYSTEM
| LAY-OUT | ITEM | DESCRIPTION |
|---|---|---|
 |
System Composition | Process Module |
| Substrate Size | ~8inch Wafer 1 Set | |
| Heating Source | Halogen Lamp | |
| Max. Heating Temperature | ~Max. 1100℃ |
